Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.
Read more at MIT News: http://web.mit.edu/newsoffice/2012/three-dimensional-self-assembling-polymers-0607.html
Animation and narration: Kevin Gotrik, graduate student, Department of Electrical Engineering and Computer Science, MIT
Music: Alastair Cameron
Tagged under: microchips,wires,microscopic,electron,micrograph,materials,science,-assembling,mechanical,engineering,electronics,inventions,innovations,-assembly,nano-materials
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